Raymond A. Fournelle, Ph.D., P.E.

Raymond A. Fournelle, Ph.D., P.E.

Professor and Associate Chair of Mechanical Engineering

Office: Haggerty Engineering 249
E-mail: raymond.fournelle@mu.edu
Phone: (414) 288-3541

Research interests

Professional preparation

1971, Ph.D., Metallurgical Engineering, University of Missouri-Rolla
1968, M.S., Metallurgical Engineering, University of Missouri-Rolla
1964, B.S., Metallurgical Engineering, University of Missouri School of Mines and Metallurgy

Selected recent publications

“Mechanical Behavior and Failure Analysis of Prosthetic Retaining Screws after Long-term Use In Vivo. Part 1: Characterization of Adhesive Wear and Structure of Retaining Screws” J. Prosthodontics, 2008, vol. 17, pp. 168-180 (with Y. S. Al Jabbari, G. Ziebert, J. Toth and A. M. Iacopino).

“Mechanical Behavior and Failure Analysis of Prosthetic Retaining Screws after Long-Term Use In Vivo. Part 2: Metallurgical and Microhardness Analysis”, J. Prosthodontics, 2008, vol. 17, pp. 181-191 (with Y. S. Al Jabbari, G. Ziebert, J. Toth and A. M. Iacopino).

“Mechanical Behavior and Failure Analysis of Prosthetic Retaining Screws after Long-term Use In Vivo. Part 3: Preload and Tensile Fracture Load Testing”, J. Prosthodontics, 2008, vol. 17, pp. 192-200 (with Y. S. Al Jabbari, G. Ziebert, J. Toth and A. M. Iacopino).

“Mechanical Behavior and Failure Analysis of Prosthetic Retaining Screws after Lon-term Use in vivo. Part 4: Failure Analysis of 10 Fractured Retaining Screws Retrieved from Three Patients”, J. Prosthodontics, 2008, vol. 17, pp. 201-210 (with Y. S. Al Jabbari, G. Ziebert, J. Toth and A. M. Iacopino).

“A Study of Intermetallic Growth Kinetics for Sn-Ag, Sn-Cu and Sn-Ag-Cu Lead-free Solders on Cu, Ni and Fe-42Ni Substrates” J. Electronic Materials, 2006, vol. 35, no. 7, pp. 1581-1592 (with N. Dariavach, P. Callahan, and J. Liang).


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